ESDR0502N
PACKAGE DIMENSIONS
UDFN6, 1.2x1.0, 0.4P
CASE 517AA
ISSUE D
EDGE OF PACKAGE
2X
PIN ONE
REFERENCE
0.10 C
2X
0.10 C
0.10 C
D
TOP VIEW
A
B
E
(A3)
A
L1
EXPOSED Cu
A1
DETAIL A
Bottom View
(Optional)
MOLD CMPD
A3
DETAIL B
Side View
(Optional)
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM  MIN   MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D 1.20 BSC
E 1.00 BSC
e 0.40 BSC
L 0.30 0.40
L1 0.00 0.15
L2 0.40 0.50
10X
0.08 C
SIDE VIEW
A1
5X
L
C
SEATING
PLANE
MOUNTING FOOTPRINT*
6X
0.42
6X
0.22
L2
1
3
0.05 C
1.07
6X
b
0.10 C A B
NOTE 3
6 4
BOTTOM VIEW
e
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb ? Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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ESDR0502N/D
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